Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
| Author | : | |
| Rating | : | 4.64 (510 Votes) |
| Asin | : | 0071386246 |
| Format Type | : | paperback |
| Number of Pages | : | 700 Pages |
| Publish Date | : | 2014-08-18 |
| Language | : | English |
DESCRIPTION:
With more than 30 years of R&D and manufacturing experience in the electronics, photonics, petroleum, nuclear, and defense industries, he has given over 200 workshops and invited presentations, authored and coauthored over 200 peer-reviewed technical publications, authored more than 100 book chapters, a
-- An engineer's guidebook demonstrating non-toxic electronics manufacturing processes-- Covers manufacture of printed circuits, integrated circuits, printed circuit boards assemblies, electronic packages, and more
Bill Collier said Outstanding book in electronics manufacturing. This is a very special book!The focus of this book is on leadfree soldering: from chip-level interconnects, IC packaging, printed circuit board (PCB) fabrication, to PCB assemblies. It provides many useful information and engineering data related to leadfree soldering. These include: design, material selection, process development, equipment selection, manufacturing, and reliability of leadfree soldering. I found these information very useful for my job as an R&D engineer.This book is very unique!Even it's focus is on leadfree sodering, however, this book talks about . "Just a nice Handbook on Leadfree Soldering" according to Bill Collier. I like this book very much! This is the most comprehensive Handbook to leadfree soldering I have ever seen. I learned a lot from this book and it is very useful for my jobs. I carry it with me when I am at work. I open this book when I have problems, and it can always help me find the solutions. I recommend this book to all the manufacturing engineers and managers who are designing and making electronics products.
"An excellent book in Flip Chip Technologies, March 2, 2000 Reviewer: David Young from Boston, MA I bought this book at NEPCON West on February 29 and read it on my way home to Boston. Also, for each subject, useful data, technical know-how, and engineering analyses are presented. I like it very much! This book covers all the important subjects (many of those I am not aware of) on low-cost flip chip Technologies. I strongly recommend it to everyone who is working in electronic packaging and interconnections. I am sure you will find it useful! Online reader review of Lau's Low Cost Flip Chip Technologies